Journals / International Journal of Chemistry and Technology / 2018 / Cilt: 2 - Sayı: 2

Electrical characteristics of Au/Ti/HfO2/n-GaAs metal-insulator-semiconductor structures with high-k interfacial layer

Pages
116–122
Publication Date
2018-12-28
DOI
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AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

The barrier increment in the rectifying contacts is very important for an adequate barrier height in FET operation and is useful for the gates of the metal-semiconductor field-effect transistors or also show promise as small signal zero-bias rectifiers and microwave mixers.

📌 3 Key Takeaways

🎯
Objective & Hypothesis:We have fabricated, metal-insulator-semiconductor (MIS) structures, the Au/Ti/HfO2/n-GaAs.
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Key Findings & Data:Metal rectifying contacts were made by dc magnetron sputtering technique, and hafnium dioxide (HfO2) interfacial insulating layer with 3, 5 and 10 nm thickness has been formed by the atomic layer depositon (ALD) technique.
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Conclusion & Impact:The barrier increment in the rectifying contacts is very important for an adequate barrier height in FET operation and is useful for the gates of the metal-semiconductor field-effect transistors or also show promise as small signal zero-bias rectifiers and microwave mixers.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:Metal-Oxide-semiconductor structures · GaAs semiconductor · Hafnia HfO2

Abstract

We have fabricated, metal-insulator-semiconductor (MIS) structures, the Au/Ti/HfO2/n-GaAs. Metal rectifying contacts were made by dc magnetron sputtering technique, and hafnium dioxide (HfO2) interfacial insulating layer with 3, 5 and 10 nm thickness has been formed by the atomic layer depositon (ALD) technique. The series resistance value from the forward bias current-voltage (I-V) curves of 3 nm and 5 nm MIS structures very slightly has reduced with a decrease in the measurement temperature. The barrier height value from I-V characteristics increased with increasing HfO2 layer thickness. The barrier increment in the rectifying contacts is very important for an adequate barrier height in FET operation and is useful for the gates of the metal-semiconductor field-effect transistors or also show promise as small signal zero-bias rectifiers and microwave mixers.

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Cite This Article

KARABULUT, A., ORAK, İ., TÜRÜT, A. (2018). Electrical characteristics of Au/Ti/HfO2/n-GaAs metal-insulator-semiconductor structures with high-k interfacial layer. International Journal of Chemistry and Technology, Cilt: 2 - Sayı: 2, 116–122. https://ajindex.com/articles/765705

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References (27)

  1. Rhoderick, E.H.; Williams, R.H. Metal-Semiconductor Contacts, Clerandon Press, Oxford University Press, 1988
  2. Mönch, W. Electronics Properties of Semiconductor Interfaces, Springer-Verlag, Berlin Heidelberg, 2004
  3. Sze, S.M. Physics of Semiconductor Devices, Second Ed. Willey, New York, 1981
  4. Colinge, J.P., Colinge, C.A. Physics of Semiconductor Devices, Kluwer Academic Publishers, New York, 2002
  5. Mo Wu, Alivov, Y.I.; Morkoc¸ H. J. Mater. Sci- Mater. El. 2008, 19, 915–951
  6. Missoum, I.; Ocak, Y.S., Benhaliliba, M., Benouis, C.E., Chaker, A. Synthetic Met. 2016, 214, 76
  7. Cheong, K.Y.; Moon, J.H.; Kim, H.J., Bahng, W.; Kim, N.K. J. Appl. Phys. 2008, 103, 084113
  8. Reddy, V.R.; Manjunath, V.; Janardhanam, V.; Kil, Y.H.; Choi, C-J. J. Electron. Mater. 2014, 43(9) 3499
  9. Turut, A. Karabulut, A.; Ejderha, K.; Bıyıklı, N. Mater. Res. Express 2015, 2, 046301
  10. Pan, T.M.; Lee, J.D.; Shu, W-H.; Chen, T.T. Appl. Phys. Lett. 2006, 89, 232908
  11. Cheung, S.K.; Cheung, N.W. Appl. Phys. Lett. 1986, 49, 85
  12. Kumar, R.; Chand, S. J. Electron. Mater. 2015, 44(1), 194
  13. E. E. Tanrıkulu, D. E. Yıldız, A. Günen, Ş. Altındal, Phys. Scripta 2015, 90, 095801
  14. Huang, W.C.; Linb, T.C.; Horng, C.T., Li, YH. Mat. Sci. Semicon. Proc. 2013, 16, 418-423 15. A. Gümüş and Ş. Altındal, Mat. Sci. Semicon. Proc. 2014, 28, 66-71
  15. Martens, K.; Wang, W.F.; Dimoulas, A.; Borghs, G.; Meuris, M.; Groseneken, G.; Maes, H.E. Solid State Electron. 2007, 51, 1101
  16. Korucu, D., Duman, S. Thin Solid Films 2013, 531, 436
  17. Jyothi, I.; Janardhanam, V; Hong, H.; Choi, C.J. Mat. Sci. Semicon. Proc. 2015, 39, 390
  18. Özden, Ş.; Tozlu C;. Pakma, O. Int. J. Photoenergy 2016, 2016, 6157905
  19. Chen J., Wang, Lv, Q. J.; Tang H.; Li, X.; J. Alloy. Compd. 2015, 649, 1220-1225
  20. Guzel, A.; Duman, S.; Yıldırım, N.; Turut, A. J. Electron. Mater. 2016, 45(6), 2808
  21. Kaushal, P.; Chand, S. Intern. J. Electron. 2016, 103(6), 937
  22. Asubay, S.; Genisel M.F.; Ocak, Y.S. Mater. Sci. Semicon. Proc. 2014, 28, 94
  23. Zizeng, L.; Mingmin, C.; Shengkai, W.; Qi, L.; Gongli, X.; Honggang L.; Haiou, L. J. Semicond. 2016, 37, 026002
  24. Morrison, D.J.; Wright, N.G.; Horsfall, A.B.; Johnson, C.M.; OÕNeill, A.G.; Knights, A.P.; Hilton, K.P.; Uren, M.J. Solid State Electron. 2000, 44, 1879
  25. Osvald, J.; Horvath, Zs.J. Appl. Surf. Sci. 2004, 234, 349
  26. Kavasoglu, N.; Kavasoglu, A.S.; Metin, B. Mater. Res. Bull. 2015, 70, 804
  27. Rahmatallahpur Sh.; Yegane, M. Physica B: C