Yapay Zeka Hızlı Bakış & Çıkarımlar
AI InsightMicrostructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.
📌 3 Maddede Bu Makale
Abstract
This study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate that the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1 wt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement of silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.