Journals / Uluslararası Mühendislik Araştırma ve Geliştirme Dergisi / 2010 / Cilt: 2 - Sayı: 1

Thermal Coefficients and Thermal Conductivities of Solid and Liquid Phases for Pure Ag, Pure Sn and Their Binary Alloys

Pages
81–91
Publication Date
2010-01-15
DOI
—
🏛️Bibliographic metadata and full text access for this article are provided via DergiPark.
DergiPark Record ↗
✨

AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

Thus the thermal conductivities of liquid phases for pure Sn and eutectic Sn-3.5 wt. % Ag binary alloy at their melting temperature were evaluated to be 0.67 and 0.92 W/K.cm, respectively by using the values of solid phase thermal conductivities, S and the thermal conductivity ratios of liquid phase to solid phase, R.

📌 3 Key Takeaways

🎯
Objective & Hypothesis:The variations of thermal conductivities of solid phases versus temperature for pure Sn and eutectic Sn-3.5 wt. % Ag, Sn- 1.5 wt. % Ag binary alloys were measured with a radial heat flow apparatus.
📊
Key Findings & Data:The thermal conductivities of the solid phases at their melting temperature were also found to be 0.606 ± 0.06, 0.84 ± 0.09, 0.69 ± 0.07 W/K.cm.
💡
Conclusion & Impact:Thus the thermal conductivities of liquid phases for pure Sn and eutectic Sn-3.5 wt. % Ag binary alloy at their melting temperature were evaluated to be 0.67 and 0.92 W/K.cm, respectively by using the values of solid phase thermal conductivities, S and the thermal conductivity ratios of liquid phase to solid phase, R.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:Thermal Conductivity · Radial Heat Flow · Directional Solidification

Abstract

The variations of thermal conductivities of solid phases versus temperature for pure Sn and eutectic Sn-3.5 wt. % Ag, Sn- 1.5 wt. % Ag binary alloys were measured with a radial heat flow apparatus. The thermal conductivities of the solid phases at their melting temperature were also found to be 0.606 ± 0.06, 0.84 ± 0.09, 0.69 ± 0.07 W/K.cm. From the graphs of the solid phases thermal conductivity variations versus temperature, temperature coefficients for pure Sn, pure Ag and eutectic Sn- 3.5 wt. % Ag, Sn- 1.5 wt. % Ag binary alloys were found to be 0.00098, 0.00024, 0.00087, 0.0014 K-1, respectively. The thermal conductivity ratios of liquid phase to solid phase for the pure Sn and eutectic Sn-3.5 wt. % Ag binary alloy at their melting temperature were found to be 1.11 and 1.09 with a Bridgman type directional solidification apparatus. Thus the thermal conductivities of liquid phases for pure Sn and eutectic Sn-3.5 wt. % Ag binary alloy at their melting temperature were evaluated to be 0.67 and 0.92 W/K.cm, respectively by using the values of solid phase thermal conductivities, S and the thermal conductivity ratios of liquid phase to solid phase, R.

🔖

Cite This Article

MEYDANERİ, F., SAATÇİ, B. (2010). Thermal Coefficients and Thermal Conductivities of Solid and Liquid Phases for Pure Ag, Pure Sn and Their Binary Alloys. Uluslararası Mühendislik Araştırma ve Geliştirme Dergisi, Cilt: 2 - Sayı: 1, 81–91. https://ajindex.com/articles/889664

📄 Full Text PDF Viewer

📄

PDF görüntüleyici hazırlanıyor...

References (22)

  1. Chiapyng Lee, Chung-Yung Lin, Yee-Wen Yen, The 260 ◦C phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints, Journal of Alloys and Compounds,458, 436-445, (2008)
  2. A. Rae, A. Handwerker, NEMI’s Lead-Free Alloy, Circuits Assembly, 2004, pp. 20-25
  3. K.J. Puttlitz, K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Marcel Dekker, New York, 2004, pp. 239-300
  4. C.-H.Wang, S.-W. Chen, Acta Mater., 54, (1), (2006), 247-253
  5. S. Hassama, Z. Baharib, B. Legendre, Phase diagram of the Ag-Bi-Sb ternary system, Journal of Alloys and Compounds, 315, (2001), 211-217, [6] Suganuma K, Niihara K. J Mater Res, 1998;13:2859
  6. Ohtani H, Miyashita M, Ishida K. J Jpn Inst Met, 1999;63:685
  7. Suganuma K, Murata T, Noguchi H, Toyoda Y. J Mater Res, 2000;15:884
  8. Vassilev GP, Tedenac JC, Dobrev ES, Evtimova SK. Arch Metal, 2001;46:249
  9. Vassilev GP, Evtimova SK, Tedenac JC, Dobrev ES. J Alloys Compd, 2002;334:182
  10. Date M, Shoji T, Fujiyoshi M, Sato K, Tu KN. Scripta Mater, 2004;51:641
  11. Kim KS, Yang JM, Yu CH, Jung IO, Kim HH. J Alloys Compd, 2004;379:314
  12. Song JM, Liu PC, Shih CL, Lin KL. J Electron Mater, 2005;34:1249
  13. Yu DQ, Xie HP, Wang L. J Alloys Compd, 2004;385:119
  14. Lin KL, Liu PC, Song JM. In: Proceedings of the 2004 electronic components and technology conference IEEE; 2004. p. 1310
  15. Chou CY, Chen SW. Acta Mater, 2006;54:2393
  16. Dragan Manasijevi´c, Jan Vˇreˇst’´al, Duˇsko Mini´c, Aleˇs Kroupa, Dragana ˇ Zivkovi´c, ˇZivan ˇ Zivkovi´c, Phase equilibria and thermodynamics of the Bi-Sb-Sn ternary system, Journal of Alloys and Compounds, 438, (2007), 150-157
  17. J. Sigelko, S. Choi, K.N. Subramanian, J.P. Lucas, T.R. Bieler, J. Electron. Mater., 28, (1999), 1184
  18. Ab Tew M, Selvaduray G. lead-free solders in microelectronics [J]. Mater Sci Eng R, 2000, R27: 95-141
  19. Zeng K, K.N. Tu. Six cases of reliability study of Pb-free solder joints in electronic packaging technology [J]. Mater Sci Eng R, 2002, R38: 55 - 105
  20. C. M. L. Wu, Yu DQ, Law CMT, et al. Properties of lead-free solder alloys with rare earth element additions [J]. Mater Sci Eng R, 2004, R44: 1- 44
  21. Kim KS, Imanishi T, Suganuma K, Kumamoto S, Aihara M. Effects of composition on microstructure and on thermal stability of Sn-Ag- In lead-free soldered joints. Trans MRS-J, 2004; 29 (5): 2005 - 8
  22. Vianco PT, Rejent JA. Properties of ternary Sn-Ag-Bi solder