Journals / Turkish Journal of Physics / 2003 / Cilt: 27 - Sayı: 3

Variation in Thickness of Copper Films Deposited at Various Distances and Angles Using the Thermionic Vacuum Arc

Pages
219–224
Publication Date
2003-03-01
DOI
—
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AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.

📌 3 Key Takeaways

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Objective & Hypothesis:The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films.
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Key Findings & Data:Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source.
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Conclusion & Impact:By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:Deposition · anodic vacuum arc · copper vapor plasma

Abstract

The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films. Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source. By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.

Özet

The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films. Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source. By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.

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Cite This Article

AKAN, T., EKEM, N. (2003). Variation in Thickness of Copper Films Deposited at Various Distances and Angles Using the Thermionic Vacuum Arc. Turkish Journal of Physics, Cilt: 27 - Sayı: 3, 219–224. https://ajindex.com/articles/724131

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