Journals / Türk Doğa ve Fen Dergisi / 2017 / Cilt: 6 - Sayı: 1

Production of WCu electrical contact material via conventional powder metallurgy method: Characterization, mechanical and electrical properties

Pages
37–42
Publication Date
2017-10-05
DOI
—
🏛️Bibliographic metadata and full text access for this article are provided via DergiPark.
DergiPark Record ↗
✨

AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

In addition, the application of the sintering temperature above the melting temperature of copper has been effective in increasing the hardness and electrical conductivity values.

📌 3 Key Takeaways

🎯
Objective & Hypothesis:In this study, the effects of increase of sintering temperature and Cu amount on microstructure, mechanical and electrical properties of WCu electrical contact materials fabricated via conventional powder metallurgy (P/M) method were investigated.
📊
Key Findings & Data:The powders obtained by adding copper at different ratios into the tungsten powders were cold pressed in a mold under 60 MPa pressure.
💡
Conclusion & Impact:In addition, the application of the sintering temperature above the melting temperature of copper has been effective in increasing the hardness and electrical conductivity values.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:Powder metallurgy · tungsten-copper · microstructure

Özet

In this study, the effects of increase of sintering temperature and Cu amount on microstructure, mechanical and electrical properties of WCu electrical contact materials fabricated via conventional powder metallurgy (P/M) method were investigated. The powders obtained by adding copper at different ratios into the tungsten powders were cold pressed in a mold under 60 MPa pressure. Samples were sintered at 1000 oC and 1100 oC using three different compositions (W-%10wtCu, W-%20wtCu- and W-%30wtCu). Microstructures of the samples were investigated by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD) analysis. Mechanical properties were determined by measuring hardness values and electrical properties were determined by measuring electrical resistivity. When the effect of the copper ratio on the microstructure, mechanical and electrical properties is analyzed, the reduction in the amount of copper has a positive effect on the hardness, while the electrical conductivity is adversely affected. In addition, the application of the sintering temperature above the melting temperature of copper has been effective in increasing the hardness and electrical conductivity values.

🔖

Cite This Article

ERÇETİN, A., ASLANTAŞ, K. (2017). Production of WCu electrical contact material via conventional powder metallurgy method: Characterization, mechanical and electrical properties. Türk Doğa ve Fen Dergisi, Cilt: 6 - Sayı: 1, 37–42. https://ajindex.com/articles/705780

📄 Full Text PDF Viewer

📄

PDF görüntüleyici hazırlanıyor...

References (12)

  1. Bloor, D., Brook, R.J., Flemings, M.C. and Mahajan, S. The Encyclopedia of Materials, Permagon Pres, Oxford, 1999
  2. Güler, Ö. and Evin, E. The investigation of contact performance of oxide reinforced copper composite via mechanical alloying, Journal of Materials Processing Technology, 209(3), 1286-1290, 2009
  3. Güler, Ö. Investigation of electrical properties of oxide reinforced copper composite produced by mechanical alloying, (Master Thesis), Fırat University, Elazığ, Turkey, 2006
  4. Gök, M.G., Kaplan, M. The production of electrical contact material by means of powder metallurgy and investigation its contact performance, 6th International Advanced Technologies Symposium (IATS’11), 294-298, Elazığ, Turkey, 2011
  5. Kim, D-G, Kim, G-S, Suk, M-J, Oh, S-T, Kim, Y-D. Effect of heating rate on microstructural homogeneity of sintered W-15 wt.% Cu nanocomposite fabricated from W–CuO powder mixture, Scr. Mater., 51, 677–681, 2004. doi:10.1016/j.scriptamat.2004.06.014
  6. Kim, J, Ryu, S, Kim, Y, Moon, I. Densification behavior of mechanically alloyed W–Cu composite powders by the double rearrangement process, Scr. Mater., 39, 669–676, 1998
  7. Liu, B.B., Xie, J.X., Qu, X.H. Fabrication of W–Cu functionally graded materials with high density by particle size adjustment and solid state hot press, Compos. Sci. Technol., 68(6), 1539–1547, 2008. doi:10.1016/j.compscitech.2007.10.023
  8. Chen, P, Shen, Q, Luo, G, Wang, C, Li, M, Zhang, L, Li, X and Zhu, B. Effect of interface modification by Cu-coated W powders on the microstructure evolution and properties improvement for Cu–W composites, Surface & Coatings Technology, 288, 8-14, 2016. doi:10.1016/j.surfcoat.2016.01.014
  9. Bhalla, A.K., Williams, J.D. Comparative assessment of explosive and other methods of compaction in the production of tungsten–copper composite, Powder Metall., 1, 31–37, 1976. doi:10.1179/pom.1976.19.1.31
  10. Li, S.B., Xie, J.X. Processing and microstructure of functionally graded W/Cu composites fabricated by multi-billet extrusion using mechanically alloyed powders, Compos. Sci. Technol., 66(13), 2329-2336, 2006. doi:10.1016/j.compscitech.2005.11.034
  11. Ihn, T.H., Lee, S.W., Joo, S.K. Effect of transition metal addition on liquid phase sintering of W–Cu, Powder Metall., 37(4), 283-288, 1994. doi:10.1179/pom.1994.37.4.283
  12. Luo, S.D., Yi, J.H., Guo, Y.L., Peng, Y.D., Li, L.Y., Ran, J.M. Microwave sintering W-Cu composites: Analyses of densification and microstructural hom