MEMS Malzeme Karakterizasyonu için Bütünleşik bir Elektrostatik Mikro Bükülme Test Yapısı Tasarımı ve Gerçekleştirilmesi

Abstract

Because of the fabrication techniques, mechanical properties of the materials used in micro electromechanical systems should be determined by utilizing micro-scale test structures. In this study, a micro bending test structure, whose actuator, sample, and readout scale are integrally fabricated on a single chip is presented. Integrated fabrication of all components eliminates the alignment problem observed in similar systems. The structure relies on the principle of bending a double-clamped beam from its center by using an electrostatic comb drive. Deflection amount is determined by using image processing techniques on the read-out scale. Designed structures are fabricated by using silicon-oninsulator wafers. As a result of the tests, elastic modulus of silicon is determined as 136 GPa in accordance with the literature.