Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend

Abstract

Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrohporetic force, gravity and stokes force, it’s found that microparticles with larger size deposit on the lower region of the bend’s outer wall. An exponential curve of deposition efficiency versus the product of stokes number and shape factor is fitted based on large number of numerical results.