Morphological, Viscosimetric and Rheological Behavior of Epoxy Resin NGTHTPTBAE and their composite (NGTHTPTBAE/MDA/TSP)

Abstract

This work presents the elaboration, formulation, morphological, viscosimetric and rheologicalbehaviors of epoxy resin NGTHTPTBAE and its composite (NGTHTPTBAE/MDA/TSP). Furthermore, westudied the viscosimetric behavior of epoxy resin NGTHTPTBAE. Then, the rheological behavior of preparedcomposites (NGTHTPTBAE/MDA/TSP) crosslinked by methylene dianiline (MDA) as hardened andformulated by trisodium phosphate (TSP) as filler at different percentages. Thus, the conservation modulusG' and loss modulus G'' (or tanδ = G''/G') are established according to temperature. From thesedependencies, we determined the glass transition temperature or tanδ maximum. Moreover, tan δ > 1 forliquid-like materials and it becomes lower than unity for solid-like materials. Finally, the dispersion of thetrisodium phosphate incorporated into various prepared composite (NGTHTPTBAE/MDA/TSP) wasdetermined using the scanning electron microscope (SEM).