Journals / Engineering Sciences / 2019 / Cilt: 14 Sayı: 2

ELECTROLESS METAL PLATING OVER ABS PLASTIC

Electroless Metal Plating Over Abs Plastic

Pages
63–70
Publication Date
2019-04-20
DOI
—
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AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

Hence, it is determined that the maximum amount of deposit is obtained in the sample which EMIC is used as catalyst with 150 min deposition time and 500 grit sandpaper size.

📌 3 Key Takeaways

🎯
Objective & Hypothesis:Plating is used to decorate objects, for corrosion inhibition, to improve solder ability, to harden, to improve wear ability, to reduce friction, to improve paint adhesion, to alter conductivity and for other purposes.
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Key Findings & Data:Experiments were carried out with two different types of ionic liquids: EMIC and DCA and with 120, 240, 320 and 500 grit sandpaper by applying sand attrition process, and constant bath temperature as 600C with 60-150 minutes of deposition times.
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Conclusion & Impact:Hence, it is determined that the maximum amount of deposit is obtained in the sample which EMIC is used as catalyst with 150 min deposition time and 500 grit sandpaper size.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:Electroless Plating · ABS Plastic · Copper Plating

Abstract

Plating is used to decorate objects, for corrosion inhibition, to improve solder ability, to harden, to improve wear ability, to reduce friction, to improve paint adhesion, to alter conductivity and for other purposes. Electroless plating is a fundamental step in the metal plating on the plastic. In this study, the electroless copper plating on Acrylonitrile butadiene styrene (ABS) was investigated. The effects of the ionic liquids as catalyst, plating time and sanding paper size were investigated on metal plating. Experiments were carried out with two different types of ionic liquids: EMIC and DCA and with 120, 240, 320 and 500 grit sandpaper by applying sand attrition process, and constant bath temperature as 600C with 60-150 minutes of deposition times. Due to the results, the copper plating on ABS plastic was a success. The surface morphology and amount of deposit analysis were performed using the Fischerscope X-Ray XDL-B System, X-ray Diffraction (XRD) and Scanning Electron Microscopy (SEM). Hence, it is determined that the maximum amount of deposit is obtained in the sample which EMIC is used as catalyst with 150 min deposition time and 500 grit sandpaper size.

Özet

Plating is used to decorate objects, for corrosion inhibition, to improve solder ability, to harden, to improve wear ability, to reduce friction, to improve paint adhesion, to alter conductivity and for other purposes. Electroless plating is a fundamental step in the metal plating on the plastic. In this study, the electroless copper plating on Acrylonitrile butadiene styrene (ABS) was investigated. The effects of the ionic liquids as catalyst, plating time and sanding paper size were investigated on metal plating. Experiments were carried out with two different types of ionic liquids: EMIC and DCA and with 120, 240, 320 and 500 grit sandpaper by applying sand attrition process, and constant bath temperature as 600C with 60-150 minutes of deposition times. Due to the results, the copper plating on ABS plastic was a success. The surface morphology and amount of deposit analysis were performed using the Fischerscope X-Ray XDL-B System, X-ray Diffraction (XRD) and Scanning Electron Microscopy (SEM). Hence, it is determined that the maximum amount of deposit is obtained in the sample which EMIC is used as catalyst with 150 min deposition time and 500 grit sandpaper size.

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Cite This Article

URAZ, C., ÖZÇELİK, T. G. (2019). ELECTROLESS METAL PLATING OVER ABS PLASTIC. Engineering Sciences, Cilt: 14 Sayı: 2, 63–70. https://ajindex.com/articles/986250

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References (14)

  1. Wikipedia, Electroplating, https://en.wikipedia.org/wiki /Electroplating #CITEREFDufour 2006IX-1(Access date:23.03.2017)
  2. Sha, W., Wu, X., and Keong, K.G., (2011). Electroless Copper and Nickel-Phosphorus Plating. Woodhead Publishing
  3. Schlesinger, M. and Paunovic M., (2010). Modern Electroplating. 5th edition, New Jersey John Wiley & Sons, Inc., 729p
  4. Sudagar J., Jianshe L., and Wei S., (2013). Electroless Nickel, Alloy, Composite and Nano Coatings-A Critical Review. Journal of Alloys and Compounds, vol:571, pp:183–204
  5. Linka, G. and Riedel, W., (1987). Galvanotechnik. 568p
  6. Kılıçarslan, A., Toptan, F. ve Kerti, I., (?). Akimsiz Nikel Kaplama Yöntemi ve Seramik Partiküllerine Uygulanmasi. Türk Mühendis ve Mimar Odaları Birliği Metalurji Mühendisleri Odası, http://www.metalurji.org.tr /dergi/ dergi154 /d154_3337.pdf (Access Date: 5.11.2016)
  7. Ang, L.L., Hor, A.S.T., Xu, G.Q., Tung, C.H., Zhao, S.P., and Wang, J.L.S., (2000). Decoration of Activated Carbon Nanotubes with Copper and Nickel. Carbon, 38, 363-372
  8. Fukuhara, C., Ohkura, H., Gonohe, K., and Igarashi, A., (2005). Low-Temperature Water-Gas Shift Reaction of Plate-Type Copper-Based Catalysts on an Aluminum Plate Prepared by Electroless Plating. Applied Catalysis A: General, vol:279, pp:195-203
  9. Ngo, H.L., LeCompte, K., Hargens, L., and McEwen, A.B., (2000). Thermal Properties of Imidazolium Ionic Liquids. Thermochimica Acta, 357-358, 97-102
  10. Occupational Safety and Health Administration, Zehirli ve Reaktif Yüksek Derecede Tehlikeli Kimyasalların Listesi, https://www.osha.gov/pls/oshaweb/owadisp.show_document?p_table=STANDARDS&p_id=9761, (Access Date: 30 Ağustos 2018)
  11. Malhotra, S.V. and Kumar, V., (?). A Profile of the in Vitro Anti-Tumor Activity of Imidazolium-based Ionic Liquids. http://www.sigmaaldrich.com/catalog/papers/20006501, (Access Date: 12 Temmuz 2018)
  12. Tang, X., Bi, C., Han, C., and Zhang, B., (2009). A New Palladium Free Surface Activation Process for Ni Electroless Plating on ABS Plastic. Materials Letters, 63, 840-842
  13. Luo, L-M., Lu, Z., Huang, X., Tan, X., Ding, X., Cheng, J., Zhu, L., and Wu, Y., (2014). Electroless Copper Plating on Pc Engineering Plastic with a Novel Palladium-Free Surface Activation Process. Surface & Coating Technology, 251, 69-73
  14. Koura, N., Nagase, H., Sato, A., Kumakura, S., Takeuchi, K., Ui, K., Tsuda, T., and Loong, C.K., (2007). Electroless Plating of Aluminum from a Room-Temperature Ionic Liquid Electrolyte. J