Journals / International Journal of Engineering Technologies / 2015 / Cilt: 1 - Sayı: 2

In-Situ Measurement Via E/M Impedance Spectroscopy Technique Using Shear Horizontal Piezoelectric Wafer Active Sensors

Pages
65–71
Publication Date
2015-05-26
DOI
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AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

Piezoelectric wafer active sensors (PWAS), that are to be utilized in this study, have recently been developed as easily manufactured, small in size and weight, and broad banded transducers to utilize in qualitative and quantitative measurement systems.

📌 3 Key Takeaways

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Objective & Hypothesis:In this paper, an electromechanical in-situ measurement method is to be developed for determination of some properties of fuel-oils.
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Key Findings & Data:EMIS method has been mostly used to determine the dynamic changes in elastic properties of solid materials.This method utilizes the shear horizontal piezoelectric wafer active sensor (SH-PWAS) to generate shear horizontal mode standing waves.
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Conclusion & Impact:Piezoelectric wafer active sensors (PWAS), that are to be utilized in this study, have recently been developed as easily manufactured, small in size and weight, and broad banded transducers to utilize in qualitative and quantitative measurement systems.
🔬Design:Research Article
📍Scope:Comprehensive Sample
⚙️Variables:E/M impedance · shear horizontal · piezoelectricity

Abstract

In this paper, an electromechanical in-situ measurement method is to be developed for determination of some properties of fuel-oils. Electromechanical impedance spectroscopy (EMIS) method is to be utilized in the measurement technique which will be developed. This method uses piezoelectric sensors that work in electromechanical principles as resonator and dynamically determines the characteristics of a medium that the resonator interacts. EMIS method has been mostly used to determine the dynamic changes in elastic properties of solid materials.This method utilizes the shear horizontal piezoelectric wafer active sensor (SH-PWAS) to generate shear horizontal mode standing waves. Piezoelectric wafer active sensors (PWAS), that are to be utilized in this study, have recently been developed as easily manufactured, small in size and weight, and broad banded transducers to utilize in qualitative and quantitative measurement systems.

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Cite This Article

KAMAŞ, T. (2015). In-Situ Measurement Via E/M Impedance Spectroscopy Technique Using Shear Horizontal Piezoelectric Wafer Active Sensors. International Journal of Engineering Technologies, Cilt: 1 - Sayı: 2, 65–71. https://ajindex.com/articles/767004

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References (6)

  1. V. Giurgiutiu, J. Bao, and W. Zhao, “Active Sensor Wave Propagation Health Monitoring of Beam and Plate Structures,” in Proc of SPIE’s 8th International Symposium on Smart Structures and Materials, 2001, no. March. C. Liang, F. P. Sun, and C. a. Rogers, “Coupled Electro-Mechanical Analysis of Adaptive Material Systems -- Determination of the Actuator Power Consumption and System Energy Transfer,” J. Intell. Mater. Syst. Struct., vol. 5, no. 1, pp. 12–20, Jan. 1994.
  2. F. P. Sun, C. Liang, and C. A. Rogers, “Structural modal analysis using collocated piezoelectric actuator/sensors: an electromechanical approach,” in Proc. SPIE 2190, Smart Structures and Materials 1994: Smart Structures and Intelligent Systems, 238, 1994. A. N. Zagrai and V. Giurgiutiu, “Electro-Mechanical Impedance Method for Damage Identification in Circular Plates,” vol. 40, 2001.
  3. G. Park, H. Sohn, C. R. Farrar, and D. J. Inman, “Overview of Piezoelectric Impedance-Based Health Monitoring and Path Forward,” Shock Vib. Dig., vol. 35, no. 6, pp. 451–463, Nov. 2003.
  4. S. Bhalla, P. Kumar, A. Gupta, and T. K. Datta, “Simplified Impedance Model for Adhesively Bonded Piezo-Impedance Transducers,” J. Aerosp. Eng., vol. 22, no. 4, pp. 373–382, Oct. 2009. H. A. Tinoco and A. L. Serpa, “Bonding influence on the electromechanical admittance of piezoelectric sensors bonded to structures based on EMI technique,” 2011. V. G. Annamdas and M. a. Radhika, “Electromechanical impedance of piezoelectric transducers for monitoring metallic and non-metallic structures: A review of wired, wireless and energy-harvesting methods,” J. Intell. Mater. Syst. Struct., vol. 24, no. 9, pp. 1021–1042, Mar. 2013.
  5. S. Srivastava, S. Bhalla, A. Madan, and A. Gupta, “Biomedical Applications of Smart Piezoelectric Materials,” in 9th International Symposium on Advanced Science and Technology in Experimental Mechanics, 2014, pp. 9–12. Y. Y. Lim and C. K. Soh, “Towards more accurate numerical modeling of impedance based high frequency harmonic vibration,” Smart Mater. Struct., vol. 23, no. 3, p. 035017, Mar. 2014.
  6. T. Kamas, B. Lin, and V. Giurgiutiu, “Analytical modeling of PWAS in-plane and out-of-plane electromechanical impedance spectroscopy (EMIS),” in SPIE Smart Structure and Materials + Nondestructive Evaluation and Health Monitoring 2013, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 2013, vol. 8692, p. 869227. T. Kamas, V. Giurgiutiu, and B. Lin, “Modeling and Experimentation of Thickn