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Journals / International Journal of Electronics Mechanical and Mechatronics Engineering / 2026 / Cilt: 3 Sayı: 4

A STUDY ON THE APPLICATION OF THE ECAP TO SURFACE PLATING

Osman Konuk
H. Erol Akata
Pages
625–630
Publication Date
2013-12-01
DOI
—
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AI Summary & Key Takeaways

AI Insight
⚡ TL;DR(Too Long; Didn't Read)

The results were discussed and some suggestions are made in order to obtain successful joints.

📌 3 Key Takeaways

🎯
Objective & Hypothesis:Metal forming processes with shear stresses that very high plastic strains are obtained in one pass are defined as severe plastic deformation (SPD) processes.
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Key Findings & Data:Strain values can additionally be increased with additional passes throughout the process.
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Conclusion & Impact:The results were discussed and some suggestions are made in order to obtain successful joints.
🔬Design:Modeling & Simulation
📍Scope:Comprehensive Sample
⚙️Variables:ECAP · Separated Dies · Cold Pressure Welding

Abstract

Metal forming processes with shear stresses that very high plastic strains are obtained in one pass are defined as severe plastic deformation (SPD) processes. Strain values can additionally be increased with additional passes throughout the process. Equal channel angular processing (ECAP) is the most applied method among the SPD processes. In the presented study, an approach of application of ECAP method was used in surface plating. Previously manufactured ECAP dies using separated die design approach were used in the study. 5083 Aluminum and Ms 58 Brass alloy strips having 2 and 4 mm thickness were placed in the ECAP die side by side and processed with single and double passes in order to model the metallic plating under cold pressure welding conditions. There were no successful and full joints between the strips although some partial joints were observed. The results were discussed and some suggestions are made in order to obtain successful joints.

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Cite This Article

Konuk, O., Akata, H. E. (2013). A STUDY ON THE APPLICATION OF THE ECAP TO SURFACE PLATING. International Journal of Electronics Mechanical and Mechatronics Engineering, Cilt: 3 Sayı: 4, 625–630. https://ajindex.com/articles/1643548

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