Dergiler / Gazi University Journal of Science / 2018 / Cilt: 31 - Sayı: 4

Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Mahmut ALKAN, Necmettin ŞAHİN, Burcu ÇİÇEK

Sayfa
1229–1244
DOI
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Abstract

In this study, in order to provide heat dissipation of the high power LEDs to be used for streetillumination, U-shaped cylindrical copper heat pipes are used. Thermal analysis of this systemwas carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis wasperformed for different numbers, diameters and lengths of heat pipes and optimum values wereobtained. Afterwards, the optimum materials to be used as components of LED packages weredetermined. In addition, the effect of the power applied to the LED chip and of ambienttemperature on the temperature distribution of the whole system was examined.