Journals / Yapı Teknolojileri Elektronik Dergisi
Yapı Teknolojileri Elektronik Dergisi
2014 · Cilt: 10 Sayı: 2
| Article | Author | Pages |
|---|---|---|
| Investigation of Adhesion Properties of Chip Seal Aggregates | Cahit GÜRER, Mustafa KARAŞAHİN | 1–11 |
| Filler Effects on Physical and Mechanical Properties of Heavy Concrete | Osman ÜNAL, Yılmaz İÇAĞA, Ayşegül ÇOŞKUN | 12–18 |
| The Effect on Physical Properties of Paper Plant Residue Gypsum Panel | Aylin AYDIN, Atilla EVCİN, Serhat BAŞPINAR | 19–26 |